Common problems of laser cutting machine processing thick plates
At present, the demand for high-power laser cutting machines is increasing, and the demand for cutting thick plates is increasing. However, thick plate cutting has high requirements for laser cutting machines. Whether it is cutting speed or cutting section, it is for laser cutting machine manufacturers. Technology is a test. What problems do you encounter in cutting thick plates? The following high-energy laser will give you an analysis.
Laser perforation is the first action before cutting. The thicker the sheet, the longer the perforation time. Therefore, in order to improve the cutting efficiency, many laser cutting machine manufacturers will improve the perforation time. Then when perforating, the more common problem is blasting. The reason for this problem is the use of high-power perforation, which is caused by high speed: the huge energy injected during perforation increases the temperature of the sheet and affects the subsequent overall cutting. If a low-power pulse is used for perforation, the time is very long, which will result in a decrease in the power of the incision and an increase in the unit cost.
cut section
The difficulty of laser cutting thick plates is much higher than that of thin plates. The aesthetics of the cutting section of Tebi is more obvious than the cutting lines of thin plates, and the accuracy is poor. There may even be serious sticking slag and other phenomena, making the processing value of the laser cutting machine not fully reflected.
To choose a high-power laser cutting machine, you must choose a manufacturer with a relatively large qualification and brand. Feiyue Laser has been specialized in manufacturing laser equipment for 17 years and has deep experience in the assembly process and cutting process of laser cutting machines. Taking into account the above problems, Feiyue Through continuous optimization of the process, the laser has set up a complete set of process libraries to avoid the occurrence of the above problems.
